IPC+2252射频微波电路板设计指南

IPC+2252射频微波电路板设计指南概述(GENERAL)... 1.1目的(Purpose).... 1.2范围(Scope).... 1.3术语和定义(Terms and Definitions).....应用文档(Application Documents)..... 2.1国际互联与封装协会(IPC)... 2.2美国测试与材料协会(American Society for Testing and Materials)... 2.3汽车工程师协会(Society of Automotive Engineers).... 2.4美国机械工程师协会(American Society of Mechanical Engineers)... 2.5国际标准化组织(International Organization for Standardization).... 2.6参考文档(Reference Information).....设计考虑(DESIGN CONSIDERATIONS)... 3.1最初输入(Initial Input)..... 3.2设计方案(Design Options)..... 3.3传输线类型，材料和元件(Transmission Line Type, Materials, and C 3.4电气设计(Electrical Design)..... 3.5机械设计(Mechanical Design)..... 3.6设计预审(Preliminary Design Review)... 3.7电路实验板(Breadboard).... 3.8原型(Prototype).... 3.9文件编制(Documentation)..... 3.10最终设计评审(Final Design Review)....文档要求(DOCUMENTATION REQUIREMENTS).... 4.1产品特性列表(Design Features Listing).... 4.2原图(Master Drawing)..... 4.3原始图形(Master Pattern)...材料(MATERIALS)..... 5.1微波印制电路板材料(Microwave Printed Circuit Board Materials)... 5.1.1基材选择(Substrate Selection)... 5.1.1.1相对介电常数(Relative Permittivity)..... 5.1.1.2损耗正切(Loss Tangent).... 5.1.1.3厚度(Thickness).....